Wet and Dry Etching Theory

Deep Wet and Dry Etching of Pyrex Glass: a Review

This paper is a review of wet and dry etching of one of the most common types of glass: Pyrex. The paper analyzes the methods for increasing the glass etch rate in HF solutions, namely, annealing, concentration, ultrasonic agitation and temperature. The limitations of the wet etching of glass are also presented. Mashing layers commonly used for deep wet etching of glass are analyzed, in terms o...

Patterning PDMS using a combination of wet and dry etching

PDMS films of 10 μm thickness can be patterned within 30 min by combining dry etching to achieve substantially vertical sidewalls with wet etching to achieve high etch rates and to protect the underlying substrate from attack. Dry etching alone would have taken 5 h, and wet etching alone would produce severe undercutting. In addition, using either technique alone produces undesirable surface mo...

Micromachining of {111} plates in 〈001〉 oriented silicon

There are basically two ways to etch silicon: dry and wet chemical etching. In micromachining, the control of the shape of the structure is accomplished by anisotropic etching through mask openings. The anisotropy of wet chemical etching is related to the crystal structure of silicon, while that of dry etching stems from the momentum of ions impinging the substrate. The latter gives us much mor...

Combined Wet and Dry Etching for High-Precision Silicon Photonic Bandgap Devices

Effect of water on bonding of one-bottle self-etching adhesives.

This study evaluated the effect of water on dentin substrate bonding of one-bottle self-etching adhesives. Dentin substrates were divided into two groups: wet and dry dentin. Wet dentin is the normal substrate for bond testing whereas dry dentin was dehydrated in a desiccator for 24 hours. Bonded dehydrated teeth were then divided into two subgroups: stored in water or in desiccator for 24 hour...